TIC? 800A thermally conductive phase change material is a high-performance low-melting-point thermal conductivity of phase change materials. At a temperature of 50 ℃, TIC? 800A of Thermal Phase change materials begin to soften and flow, filling the contact interface of the fins and the integrated circuit board subtle irregular gap, in order to achieve the purpose of reducing the thermal resistance. TIC? 800A thermally conductive phase change material Series is a flexible solid at room temperature, without reinforcing materials used independently from reinforced material impact on the thermal conductivity. The TIC? 800A series of thermally conductive phase change material at a temperature of 130 ℃ for 1000 hours, or experienced repeated cycle tests of -25 ℃ to 125 ℃ thermal conductivity still will not fade away. At the working temperature, wherein the phase change material softened while not completely liquefied or overflow. Product Features: 0.018 ℃-in2 / W thermal resistance "at room temperature with natural stickiness without adhesives, radiator without preheating application: high frequency microprocessor notebook and desktop computer computer servers memory the module cache chip the IGBTs TICTM800A series features table Product Name TICTM803A TICTM805A TICTM808A TICTM810A test standard color Ashy (gray) (gray) Ashy Ashy Ashy (gray) (gray) Visual (visual) the density 2.5g/cc working temperature -25 ℃ ~ 125 ℃ phase transition temperature of 50 ℃ ~ 60 ℃ setting temperature 70 ℃ for 5 minutes the thermal conductivity of 2.5 W / mK ASTM D5470 (modified)