TIF? 100 series thermal silica filled heating device and a heat sink or a metal between the base of the air gap, they are flexible, elastic characteristics, it can be used to cover a very uneven surface. Heat conduction from the separation device or the entire PCB to the metal housing or the diffusion plate, which can improve the efficiency and service life of the heat generating electronic components. Product Features: good thermal conductivity: 1.5W/mK with self-adhesive without the need for additional the surface binder "high compressibility, both elastic soft, suitable for low pressure applications environment" offers a variety of thickness select products application: the bottom of the radiator or the framework of the high-speed hard drive RDRAM memory modules micro heat pipe radiator automotive engine control device communications hardware "portable electronic device" semiconductor automatic test equipment